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In the semiconductor industry, the application of machining is usually concentrated on the production of semiconductor manufacturing equipment and some key components.
Although semiconductor products themselves rely more on fine processes such as lithography, chemical etching and thin film deposition, machining still occupies an important position in manufacturing equipment and precision components. The following are some semiconductor-related products or components suitable for machining:
1. Wafer Clamps
• Purpose: Wafer clamps are used to fix and hold wafers during semiconductor manufacturing. These clamps must meet requirements such as high precision, high temperature resistance and corrosion resistance.
• Machining: High-precision CNC machine tools and grinders are used for processing to ensure the dimensional accuracy and surface finish of the clamps.
• Material: Stainless steel, ceramic or aluminum alloy are usually used.
2. Wafer Transfer Components
• Purpose: Wafers need to be transferred between different process steps in semiconductor equipment. These components include robotic arms, guide rails, etc.
• Machining: CNC machining is used to manufacture structural parts such as transfer robotic arms and guide rails, which require high precision and durability.
• Materials: Aluminum alloy, stainless steel and high-strength engineering plastics are mostly used.
3. Vacuum Chambers
• Application: Vacuum chambers are a key part of semiconductor manufacturing equipment and are used in processes such as thin film deposition and ion implantation.
• Machining: The manufacture of chambers involves large-scale milling, drilling and surface treatment to ensure vacuum tightness and internal finish.
• Materials: Stainless steel and aluminum alloys are common materials, and CNC machine tools and large lathes are used to process these chambers.
4. Fixtures and Frames
• Application: Structural parts that support equipment and workpieces, such as the base of machine tools, equipment brackets, etc., require high rigidity and stability.
• Machining: Large brackets and frames are processed by lathes and milling machines. These parts often require high precision and good structural stability.
• Materials: Steel and aluminum alloys are common choices.
5. Lithography Machine Parts
• Application: Lithography machines are core equipment for semiconductor manufacturing. Some mechanical parts in the lithography system, such as lens holders and motion platforms, require high-precision processing.
• Machining: The processing of lens holders and motion platforms involves CNC milling, drilling, grinding, etc., to ensure that they have extremely high positioning accuracy.
• Material: Made of aluminum alloy or stainless steel, some precision parts use ceramic materials.
6. High-precision screws and fasteners in semiconductor manufacturing equipment
• Application: Many fasteners in semiconductor equipment, such as high-precision screws and micro bolts, require very high dimensional accuracy and surface finish.
• Machining: Swiss-type machines can be used to produce these micro fasteners to ensure the dimensional accuracy and consistency of each product.
• Material: Stainless steel or titanium alloy is usually used, which is corrosion-resistant and high-strength.
7. Cooling System Components
• Application: Semiconductor equipment generates a lot of heat when it is running, and the efficient operation of the cooling system depends on precise cooling pipes, heat sinks and other components.
• Machining: Cooling pipes, heat sinks and pump bodies are manufactured through CNC machining and precision casting.
• Materials: Aluminum alloy, stainless steel and copper are commonly used materials.
8. Mechanical Seals
• Application: Mechanical seals are used to prevent leakage of liquid or gas in equipment, and are commonly found in vacuum equipment and chemical vapor deposition equipment.
• Machining: Seals require high-precision turning and grinding processes to ensure good sealing effects.
• Materials: Cemented carbide, ceramics or special engineering plastics.
9. Conductive Frames and Electrodes
• Application: Conductive frames, electrodes and other components are widely used in electrochemical deposition, plasma treatment and other steps in semiconductor processing.
• Machining: The production of these components requires high-precision CNC machining to ensure stable and uniform current conduction.
• Materials: Copper, tungsten, titanium and other materials with good conductivity.
10. Wafer Cleaning Equipment Parts
• Application: Nozzles, rotary tables and other parts in wafer cleaning equipment need to be machined to achieve high precision requirements.
• Machining: Precision CNC lathes and milling machines are used to manufacture these complex-shaped parts to ensure accuracy and reliability.
• Materials: Stainless steel, ceramics and engineering plastics.
Summary: Although the semiconductor industry essentially relies on precision optical, chemical and physical processing technologies, machining still plays an important role in manufacturing equipment, transmission systems and some key components. Combined with CNC, lathes, Swiss machines and grinders, high-precision components and equipment support can be provided for semiconductor manufacturing.
These products usually require extremely high surface finish and dimensional accuracy to ensure long-term stable operation in high temperature, high pressure and chemical environments.
